Comments: How Chip-On-Boards are Made


Comments 7 comments

  • I need to get a die sensor wirebonded, but the whole process seemed overwhelming - till I saw this tutorial.

    Especially by pointing out how COB doesn’t necessarily require advanced tools and processes, you’ve made my job on hand look doable. Not to mention the fact that finally I know whats under those black blobs :-)

    Thanx a lot!

    • You’re welcome! If you get to a point where you are die-bonding please please take a video and send it our way. We want to learn more about die-bonding from our readers too!

  • Thank you for demystifying those black blobs!

    I’m always amazed at how simple some things are once you get to peek under the cover.

    ;-> (cjh)

  • Fascinating! I’ve noticed those black blobs before but haven’t had the time to investigate further. Excellent article - thanks for sharing!

  • Very cool article! I’ve always been curious about how these are made. Thanks for sharing!

  • It would be unlikely that the wire bonding process is done by soldering the wires. Usually this is done using thermosonic bonding, which uses a combination of heat, pressure, and ultrasonic vibrations to bond the wires. At least this is how it is done for IC packaging, so it is unlikely that they use something completely different for COB wire bonding.

    • Excellent feedback! I have soldering stuck in my mind because that’s what I do all day long but you’re right it’s thermosonic bonding. Neat wikipedia article about it too. Thanks for chiming in. I updated the tutorial with your comment as well.

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